Local IC Packaging & Assembly


Silitronics Inc.

Wafer-In to Packages-Out in 1 to 4 days San Jose bay area service.
Our service consists of receiving semiconductor, Mems, Medical, and sensor devices in wafer form and performing a series of highly precise manufacturing steps to provide finished, packaged ICs. Specializes in quickturn assembly service for BGA, Flip Chip, and Hybrid packages. Molding equipment for BGA's. Wirebond 8 inch wafers. The Metal, ceramic with seals, and RF Packages are the main focus. ISO approved. Custom packages available.

 

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